臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立成功大學	2017-10-25	Non-deformation recrystallization of metal with electric current stressing	Liang;PinChu;Lin;Kwang-Lung
國立成功大學	2017-10	The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-08-31	The mechanism of an increase in electrical resistance in Al thin film induced by current stressing	Liang;Chien-Lung;Lee;Ssu-Wei;Lin;Kwang-Lung
國立成功大學	2017-07-25	Current induced rapid phase transformation in Au/Sn reaction couple	Chiu;Tsung-Chieh;Lin;Kwang-Lung
國立成功大學	2017-06-15	Effect of Au/Pd bilayer metallization on solder/Cu interfacial reaction and growth kinetics of Cu-Sn intermetallic compounds during solid-state aging	Liang;Chien-Lung;Lin;Kwang-Lung;Cheng;Po-Jen
國立成功大學	2017-06	Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps	Chen;Chiao-Wen;Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lee;Chiu-Wen;Lin;Kwang-Lung
國立成功大學	2017-01	Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles	Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學	2017-01	Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate	Niu;Xi;Lin;Kwang-Lung
國立成功大學	2017	Fundamentals of Solder Alloys in 3D Packaging	Lin;Kwang-Lung

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