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Institution Date Title Author
國立中山大學 2009 High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh

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