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Institution Date Title Author
元智大學 2014-1-1 EBSD investigation of Cu-Sn IMC microstructural evolution in Cu/Sn-Ag/Cu microbumps during isothermal annealing S. J. Wang; L. H. Hsu; N. K. Wang; Cheng-En Ho
元智大學 2012-01 Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System Cheng-En Ho; L. H. Hsu; S. W. Lin; M. A. Rahman
元智大學 2012-01 Solid-Solid Reaction between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses Cheng-En Ho; W. H. Wu; L. H. Hsu; C. S. Lin
元智大學 2010-05 An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band LNA Applications 許恒通; C.-T. Wang; C.-I. Kuo; W.-C. Lim; L.-H. Hsu; Y. Miyamoto; E.Y. Chang; S.-P. Tsai; Y.-S. Chiu
元智大學 2010-05 An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band LNA Applications 許恒通; C.-T. Wang; C.-I. Kuo; W.-C. Lim; L.-H. Hsu; Y. Miyamoto; E.Y. Chang; S.-P. Tsai; Y.-S. Chiu

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