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"lai ming fang"

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Institution Date Title Author
國立交通大學 2017-04-21T06:49:41Z An implementation of performance-driven block and I/O placement for chip-package codesign Lai, Ming-Fang; Chen, Hung-Ming
國立交通大學 2014-12-16T06:15:12Z ESD PROTECTION STRUCTURE FOR 3D IC Chen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
國立交通大學 2014-12-16T06:14:57Z Integrated Circuit Device Chen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
國立交通大學 2014-12-16T06:13:54Z Integrated circuit device Chen Kuan-Neng; Lai Ming-Fang; Chen Hung-Ming
國立交通大學 2014-12-08T15:21:13Z Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies Lai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng
國立交通大學 2014-12-08T15:12:59Z Fast flip-chip pin-out designation respin by pin-block design and floorplanning for package-board codesign Lee, Ren-Jie; Lai, Ming-Fang; Chen, Hung-Ming

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