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Taiwan Academic Institutional Repository >
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"lai y s"
Showing items 116-125 of 133 (14 Page(s) Totally) << < 5 6 7 8 9 10 11 12 13 14 > >> View [10|25|50] records per page
| 國立臺灣大學 |
2008-01 |
Boost Converter With Coupled Inductors and Buck-Boost Type of Active Clamp
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Wu, T.-F.; Lai, Y.-S.; Hung, J.-C.; Chen, Y.-M. |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
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Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立東華大學 |
2008 |
Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints
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Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S. |
| 國立臺灣科技大學 |
2008 |
Temperature-dependent characteristics of pulse-laser-deposited (Pb,Sr)TiO3 films at low temperatures
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Wang, J.-L.;Lai, Y.-S.;Chiou, B.-S.;Chou, C.-C.;Lee, T.G.-Y.;Tseng, H.-Y.;Jan, C.-K.;Cheng, H.-C. |
| 國立臺灣大學 |
2008 |
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
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Lin, Y.L.; Lai, Y.S.; Lin, Y.W.; Kao, C.R. |
| 國立臺灣科技大學 |
2007 |
Dependence of ferroelectric characteristics on the deposition temperature of (Pb,Sr)TiO3 films
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Wang, J.-L.;Lai, Y.-S.;Shye, D.-C.;Chou, C.-C.;Chiou, B.-S.;Juan, C.-P.;Cheng, H.-C. |
| 國立臺灣科技大學 |
2007 |
Structural and electrical investigations of pulse-laser-deposited (Pb,Sr) Ti O3 films at various oxygen partial pressures
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Wang, J.-L.;Lai, Y.-S.;Liou, S.-C.;Chou, C.-C.;Tsai, C.-C.;Juan, C.-P.;Tseng, H.-Y.;Jan, C.-K.;Cheng, H.-C. |
| 中山醫學大學 |
2007 |
Extramedullary plasmacytoma (EMP): Report of a case manifested as a mediastinal mass and multiple pulmonary nodules and review of literature
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Luh, S.-P.;Lai, Y.-S.;Tsai, C.-H.;Tsao, Tsao T.C.-Y. |
| 國立成功大學 |
2006-03 |
Exploring the sheet resistance variation with various beam current densities in low-energy ion implantation
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Lai, Y. S.; Chen, Jen-Sue; Sun, H. L.; Chen, Z. B.; Tien, C. T.; Yeh, S. Y.; Chen, C. W.; Lee, F. S.; Ho, Y. S.; Hsu, P. Y.; Wu, H. H.; Wang, J. H.; Yang, C. M. |
| 國立臺灣大學 |
2006 |
Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration
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Lin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R. |
Showing items 116-125 of 133 (14 Page(s) Totally) << < 5 6 7 8 9 10 11 12 13 14 > >> View [10|25|50] records per page
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