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Showing items 116-125 of 133  (14 Page(s) Totally)
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Institution Date Title Author
國立臺灣大學 2008-01 Boost Converter With Coupled Inductors and Buck-Boost Type of Active Clamp Wu, T.-F.; Lai, Y.-S.; Hung, J.-C.; Chen, Y.-M.
國立東華大學 2008 Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W.
國立東華大學 2008 Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S.
國立臺灣科技大學 2008 Temperature-dependent characteristics of pulse-laser-deposited (Pb,Sr)TiO3 films at low temperatures Wang, J.-L.;Lai, Y.-S.;Chiou, B.-S.;Chou, C.-C.;Lee, T.G.-Y.;Tseng, H.-Y.;Jan, C.-K.;Cheng, H.-C.
國立臺灣大學 2008 Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration Lin, Y.L.; Lai, Y.S.; Lin, Y.W.; Kao, C.R.
國立臺灣科技大學 2007 Dependence of ferroelectric characteristics on the deposition temperature of (Pb,Sr)TiO3 films Wang, J.-L.;Lai, Y.-S.;Shye, D.-C.;Chou, C.-C.;Chiou, B.-S.;Juan, C.-P.;Cheng, H.-C.
國立臺灣科技大學 2007 Structural and electrical investigations of pulse-laser-deposited (Pb,Sr) Ti O3 films at various oxygen partial pressures Wang, J.-L.;Lai, Y.-S.;Liou, S.-C.;Chou, C.-C.;Tsai, C.-C.;Juan, C.-P.;Tseng, H.-Y.;Jan, C.-K.;Cheng, H.-C.
中山醫學大學 2007 Extramedullary plasmacytoma (EMP): Report of a case manifested as a mediastinal mass and multiple pulmonary nodules and review of literature Luh, S.-P.;Lai, Y.-S.;Tsai, C.-H.;Tsao, Tsao T.C.-Y.
國立成功大學 2006-03 Exploring the sheet resistance variation with various beam current densities in low-energy ion implantation Lai, Y. S.; Chen, Jen-Sue; Sun, H. L.; Chen, Z. B.; Tien, C. T.; Yeh, S. Y.; Chen, C. W.; Lee, F. S.; Ho, Y. S.; Hsu, P. Y.; Wu, H. H.; Wang, J. H.; Yang, C. M.
國立臺灣大學 2006 Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration Lin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R.

Showing items 116-125 of 133  (14 Page(s) Totally)
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