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"lai y s"的相關文件
顯示項目 111-120 / 133 (共14頁)
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| 國立臺灣科技大學 |
2010 |
An efficient predictive watershed video segmentation algorithm using motion vectors
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Chung K.-L.; Lai Y.-S.; Huang P.-L. |
| 國立臺灣大學 |
2010 |
Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer
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Chang, C.C.; Chung, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立臺灣大學 |
2010 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
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Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R. |
| 國立臺灣大學 |
2010 |
Electromigration in flip chip solder joints under extra high current density
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Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; Kao, C.R. |
| 國立東華大學 |
2008-10 |
Alloying Modification of Sn-Ag-Cu Solders by Manganese and Titanium
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Song, J. M.; Lai,Y. S.; Uan,J. Y.; Lee,N. C.; Chiu,Y. T. |
| 國立臺灣大學 |
2008-01 |
Boost Converter With Coupled Inductors and Buck-Boost Type of Active Clamp
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Wu, T.-F.; Lai, Y.-S.; Hung, J.-C.; Chen, Y.-M. |
| 國立東華大學 |
2008 |
Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections
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Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W. |
| 國立東華大學 |
2008 |
Ball Impact Responses of Ni or Ge Doped Sn-Ag-Cu Solder Joints
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Song,J. M.; Chang,H.C.; Chiu,Y. T.; Lai,Y. S. |
| 國立臺灣科技大學 |
2008 |
Temperature-dependent characteristics of pulse-laser-deposited (Pb,Sr)TiO3 films at low temperatures
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Wang, J.-L.;Lai, Y.-S.;Chiou, B.-S.;Chou, C.-C.;Lee, T.G.-Y.;Tseng, H.-Y.;Jan, C.-K.;Cheng, H.-C. |
| 國立臺灣大學 |
2008 |
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
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Lin, Y.L.; Lai, Y.S.; Lin, Y.W.; Kao, C.R. |
顯示項目 111-120 / 133 (共14頁)
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