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Showing items 16-25 of 60  (6 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:11:21Z Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor deposition Jian, Sheng-Rui; Jang, Jason Shian-Ching; Lai, Yi-Shao; Yang, Ping-Feng; Yang, Chu-Shou; Wen, Hua-Chiang; Tsai, Chien-Huang
國立交通大學 2014-12-08T15:10:56Z Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng
國立交通大學 2014-12-08T15:08:08Z Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao
國立交通大學 2014-12-08T15:07:39Z Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate He, Bo-Ching; Cheng, Chun-Hu; Wen, Hua-Chiang; Lai, Yi-Shao; Yang, Ping-Feng; Lin, Meng-Hung; Wu, Wen-Fa; Chou, Chang-Pin
國立交通大學 2014-12-08T15:07:00Z Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao
國立交通大學 2014-12-08T15:06:46Z Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si films He, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin
國立成功大學 2014-11 Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta
國立成功大學 2013-09 Interconversions between linear viscoelastic functions by using relaxation-creep duality representation Chen, Dao-Long; Yang, Ping-Feng; Lai, Yi-Shao; Chen, Tei-Chen
國立成功大學 2013-09 The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao
國立成功大學 2013-02-05 Electrorecrystallization of Metal Alloy Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao

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