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Taiwan Academic Institutional Repository >
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"lai yi shao"
Showing items 16-25 of 60 (6 Page(s) Totally) << < 1 2 3 4 5 6 > >> View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:11:21Z |
Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor deposition
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Jian, Sheng-Rui; Jang, Jason Shian-Ching; Lai, Yi-Shao; Yang, Ping-Feng; Yang, Chu-Shou; Wen, Hua-Chiang; Tsai, Chien-Huang |
| 國立交通大學 |
2014-12-08T15:10:56Z |
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:39Z |
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate
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He, Bo-Ching; Cheng, Chun-Hu; Wen, Hua-Chiang; Lai, Yi-Shao; Yang, Ping-Feng; Lin, Meng-Hung; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
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Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:06:46Z |
Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si films
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He, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立成功大學 |
2014-11 |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
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Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta |
| 國立成功大學 |
2013-09 |
Interconversions between linear viscoelastic functions by using relaxation-creep duality representation
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Chen, Dao-Long; Yang, Ping-Feng; Lai, Yi-Shao; Chen, Tei-Chen |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
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Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
Showing items 16-25 of 60 (6 Page(s) Totally) << < 1 2 3 4 5 6 > >> View [10|25|50] records per page
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