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"lai yi shao"的相關文件
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| 國立交通大學 |
2014-12-08T15:06:46Z |
Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si films
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He, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立成功大學 |
2014-11 |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
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Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta |
| 國立成功大學 |
2013-09 |
Interconversions between linear viscoelastic functions by using relaxation-creep duality representation
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Chen, Dao-Long; Yang, Ping-Feng; Lai, Yi-Shao; Chen, Tei-Chen |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
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Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立成功大學 |
2012-12 |
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
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Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
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Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
The performance and fracture mechanism of solder joints under mechanical reliability test
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Jang, Wei-Luen; Wang, Tai-Siang; Lai, Yen-Fen; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
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