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"lai yi shao"的相關文件
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| 國立成功大學 |
2012-12 |
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
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Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
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Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
The performance and fracture mechanism of solder joints under mechanical reliability test
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Jang, Wei-Luen; Wang, Tai-Siang; Lai, Yen-Fen; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
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Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-06 |
Effects of Curing and Chemical Aging on Warpage-Characterization and Simulation
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Chiu, Tz-Cheng; Kung, Che-Li; Huang, Hong-Wei; Lai, Yi-Shao |
| 國立臺灣大學 |
2011 |
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding
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Chen, Jiunn; Lai, Yi-Shao; Wang, Yi-Wun; Kao, C.R. |
| 臺大學術典藏 |
2011 |
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding
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Kao, C.R.; Wang, Yi-Wun; Lai, Yi-Shao; Chen, Jiunn; Chen, Jiunn; Lai, Yi-Shao; Wang, Yi-Wun; Kao, C.R. |
| 東方設計學院 |
2010-11-18 |
Growth of Semi-polar (1013) AIN Films on the Silicon
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Jhong, Shih-Bin; Wu, Sean; Liu, Kuan-Ting; Lin, Zhi-Xun; Lai, Yi-Shao; Yang, Ping-Feng; 吳信賢; (東方設計學院電子與資訊系) |
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