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"lai yi shao"的相關文件
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| 國立成功大學 |
2010-02 |
New Bending Algorithm for Field-Driven Molecular Dynamics
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Chen, Dao-Long; Chen, Tei-Chen; Lai, Yi-Shao |
| 國立成功大學 |
2009-06 |
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Chen, Rong-Sheng |
| 國立成功大學 |
2009-03-15 |
Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering
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Yang, Ping-Feng; Jian, Sheng-Rui; Wu, Sean; Lai, Yi-Shao; Wang, Chung-Ting; Chen, Rong-Sheng |
| 國立成功大學 |
2009-03 |
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys
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Jenq, Syh-Tsang; Chang, Hsuan-Hu; Lai, Yi-Shao; Tsai, Tsung-Yueh |
| 東方設計學院 |
2009-01 |
Structural and Mechanical Characteristics of (103)AIN Films Prepared by Radio Frequency Magnetron Sputtering
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Yang, Ping-Feng; Jian, Sheng-Rui; Wu, Sean; Lai, Yi-Shao; Wang, Chung-Ting; Chen, Rong-Sheng; 吳信賢; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2009-01 |
Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
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Wang, Tong Hong; Lai, Yi-Shao; Lee, Chang-Chi; Lin, Yu-Cheng |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
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Song,J. M.; Lai,Yi-Shao |
| 國立成功大學 |
2008-11 |
Finite element model verification for packaged printed circuit board by experimental modal analysis
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Lee, Ying-Chih; Wang, Bor-Tsuen; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 國立成功大學 |
2008-09-08 |
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
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