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"lai yi shao"的相關文件
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| 國立成功大學 |
2009-01 |
Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
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Wang, Tong Hong; Lai, Yi-Shao; Lee, Chang-Chi; Lin, Yu-Cheng |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
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Song,J. M.; Lai,Yi-Shao |
| 國立成功大學 |
2008-11 |
Finite element model verification for packaged printed circuit board by experimental modal analysis
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Lee, Ying-Chih; Wang, Bor-Tsuen; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 國立成功大學 |
2008-09-08 |
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-06-25 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
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Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; Chen, Jiunn; Chen, Rong-Sheng |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
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Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2008-05 |
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
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Tsai, Tsung-Yueh; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 東方設計學院 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang ,Ping-Feng; Wen,Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu,Sean; 吳信賢; Chen, Rong-Sheng; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang, Ping-Feng; Wen, Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu, Sean; Chen, Rong-Sheng |
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