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"lai yi shao"的相关文件
显示项目 16-60 / 60 (共2页)
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| 國立交通大學 |
2014-12-08T15:11:21Z |
Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor deposition
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Jian, Sheng-Rui; Jang, Jason Shian-Ching; Lai, Yi-Shao; Yang, Ping-Feng; Yang, Chu-Shou; Wen, Hua-Chiang; Tsai, Chien-Huang |
| 國立交通大學 |
2014-12-08T15:10:56Z |
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:39Z |
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate
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He, Bo-Ching; Cheng, Chun-Hu; Wen, Hua-Chiang; Lai, Yi-Shao; Yang, Ping-Feng; Lin, Meng-Hung; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
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Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:06:46Z |
Effect of annealing treatment and nanomechanical properties for multilayer Si(0.8)Ge(0.2)-Si films
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He, Bo-Ching; Wen, Hua-Chiang; Lin, Meng-Hung; Lai, Yi-Shao; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立成功大學 |
2014-11 |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
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Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta |
| 國立成功大學 |
2013-09 |
Interconversions between linear viscoelastic functions by using relaxation-creep duality representation
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Chen, Dao-Long; Yang, Ping-Feng; Lai, Yi-Shao; Chen, Tei-Chen |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
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Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立成功大學 |
2012-12 |
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
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Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
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Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
The performance and fracture mechanism of solder joints under mechanical reliability test
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Jang, Wei-Luen; Wang, Tai-Siang; Lai, Yen-Fen; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
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Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-06 |
Effects of Curing and Chemical Aging on Warpage-Characterization and Simulation
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Chiu, Tz-Cheng; Kung, Che-Li; Huang, Hong-Wei; Lai, Yi-Shao |
| 國立臺灣大學 |
2011 |
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding
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Chen, Jiunn; Lai, Yi-Shao; Wang, Yi-Wun; Kao, C.R. |
| 臺大學術典藏 |
2011 |
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding
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Kao, C.R.; Wang, Yi-Wun; Lai, Yi-Shao; Chen, Jiunn; Chen, Jiunn; Lai, Yi-Shao; Wang, Yi-Wun; Kao, C.R. |
| 東方設計學院 |
2010-11-18 |
Growth of Semi-polar (1013) AIN Films on the Silicon
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Jhong, Shih-Bin; Wu, Sean; Liu, Kuan-Ting; Lin, Zhi-Xun; Lai, Yi-Shao; Yang, Ping-Feng; 吳信賢; (東方設計學院電子與資訊系) |
| 國立成功大學 |
2010-02 |
New Bending Algorithm for Field-Driven Molecular Dynamics
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Chen, Dao-Long; Chen, Tei-Chen; Lai, Yi-Shao |
| 國立成功大學 |
2009-06 |
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Chen, Rong-Sheng |
| 國立成功大學 |
2009-03-15 |
Structural and mechanical characteristics of (103) AlN thin films prepared by radio frequency magnetron sputtering
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Yang, Ping-Feng; Jian, Sheng-Rui; Wu, Sean; Lai, Yi-Shao; Wang, Chung-Ting; Chen, Rong-Sheng |
| 國立成功大學 |
2009-03 |
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys
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Jenq, Syh-Tsang; Chang, Hsuan-Hu; Lai, Yi-Shao; Tsai, Tsung-Yueh |
| 東方設計學院 |
2009-01 |
Structural and Mechanical Characteristics of (103)AIN Films Prepared by Radio Frequency Magnetron Sputtering
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Yang, Ping-Feng; Jian, Sheng-Rui; Wu, Sean; Lai, Yi-Shao; Wang, Chung-Ting; Chen, Rong-Sheng; 吳信賢; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2009-01 |
Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
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Wang, Tong Hong; Lai, Yi-Shao; Lee, Chang-Chi; Lin, Yu-Cheng |
| 國立東華大學 |
2008-12 |
Electromigration Reliability with Respect to Cu Content in Solder Joint System
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Song,J. M.; Lai,Yi-Shao |
| 國立成功大學 |
2008-11 |
Finite element model verification for packaged printed circuit board by experimental modal analysis
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Lee, Ying-Chih; Wang, Bor-Tsuen; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 國立成功大學 |
2008-09-08 |
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
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Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Chu-Shou; Chen, Rong-Sheng |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-06-25 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
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Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; Chen, Jiunn; Chen, Rong-Sheng |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
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Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2008-05 |
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
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Tsai, Tsung-Yueh; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 東方設計學院 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang ,Ping-Feng; Wen,Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu,Sean; 吳信賢; Chen, Rong-Sheng; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang, Ping-Feng; Wen, Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu, Sean; Chen, Rong-Sheng |
| 國立成功大學 |
2008-02 |
Molecular dynamics simulation of nanoindentation-induced mechanical deformation and phase transformation in monocrystalline silicon
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Lin, Yen-Hung; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Ping-Feng |
| 國立成功大學 |
2008-01 |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
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Wang, Tong Hong; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立臺灣大學 |
2008 |
Tin Whisker Growth Induced by High Electron Current Density
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Lin, Y.W.; Lai, Yi-shao; Lin, Y.L.; Tu, Chun-Te; Kao, C.R. |
| 國立成功大學 |
2007-12-30 |
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
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Lin, Yen-Hung; Chen, Tei-Chen; Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao |
| 國立成功大學 |
2007-10 |
High-G drop impact response and failure analysis of a chip packaged printed circuit board
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Jenq, Syh-Tsang; Sheu, H. S.; Yeh, Chang-Lin; Lai, Yi-Shao; Wu, Jenq-Dah |
| 國立成功大學 |
2007-08 |
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses
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Tsai, Tsung-Yueh; Yeh, Chang-Lin; Lai, Yi-Shao; Chen, Rong-Sheng |
| 東方設計學院 |
2007-07-01 |
Influence of RF Powers for Sputtering (103) Oriented AlN Films on Silicon Substrate
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Yu, Jian-Shuo; Wu, Sean; 吳信賢; Lee, Maw-Shung; Ro, Ruyen; Chen, Kang-I; 陳剛毅; Lai, Yi-Shao; Yang, Ping-Feng; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2007-01 |
Transient submodeling analysis for board-level drop tests of electronic packages
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Tsai, Tsung-Yueh; Yeh, Chang-Lin; Lai, Yi-Shao; Chen, Rong-Sheng |
| 國立成功大學 |
2006-09 |
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
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Wang, Tong-Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立臺灣大學 |
2006 |
In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing
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Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R. |
显示项目 16-60 / 60 (共2页)
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