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"lai yi shao"的相關文件
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| 國立成功大學 |
2008-06-25 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
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Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; Chen, Jiunn; Chen, Rong-Sheng |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
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Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2008-05 |
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
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Tsai, Tsung-Yueh; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng |
| 東方設計學院 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang ,Ping-Feng; Wen,Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu,Sean; 吳信賢; Chen, Rong-Sheng; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2008-03 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Yang, Ping-Feng; Wen, Hua-Chiang; Jian, Sheng-Rui; Lai, Yi-Shao; Wu, Sean; Chen, Rong-Sheng |
| 國立成功大學 |
2008-02 |
Molecular dynamics simulation of nanoindentation-induced mechanical deformation and phase transformation in monocrystalline silicon
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Lin, Yen-Hung; Jian, Sheng-Rui; Lai, Yi-Shao; Yang, Ping-Feng |
| 國立成功大學 |
2008-01 |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions
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Wang, Tong Hong; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立臺灣大學 |
2008 |
Tin Whisker Growth Induced by High Electron Current Density
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Lin, Y.W.; Lai, Yi-shao; Lin, Y.L.; Tu, Chun-Te; Kao, C.R. |
| 國立成功大學 |
2007-12-30 |
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
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Lin, Yen-Hung; Chen, Tei-Chen; Yang, Ping-Feng; Jian, Sheng-Rui; Lai, Yi-Shao |
| 國立成功大學 |
2007-10 |
High-G drop impact response and failure analysis of a chip packaged printed circuit board
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Jenq, Syh-Tsang; Sheu, H. S.; Yeh, Chang-Lin; Lai, Yi-Shao; Wu, Jenq-Dah |
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