| 國立成功大學 |
2016-12 |
Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu
|
Lee, Hwa-Teng; Huang, Kuo-Chen |
| 國立成功大學 |
2016-01 |
Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder
|
Lee, Hwa-Teng; Huang, Kuo-Chen |
| 國立成功大學 |
2012-10-15 |
Development of fine-grained structure and the mechanical properties of nickel-based Superalloy 718
|
Lee, Hwa-Teng; Hou, Wen-Hsin |
| 國立成功大學 |
2012-09 |
Study of delta Phase on Static Recrystallization Behavior of Inconel 718 Alloy
|
Lee, Hwa-Teng; Hou, Wen-Hsin |
| 國立成功大學 |
2012-07 |
Influence of Precipitated Phase Formation on Recrystallization Behavior of Superalloy 718
|
Lee, Hwa-Teng; Hou, Wen-Hsin |
| 國立成功大學 |
2012-04 |
Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718
|
Lee, Hwa-Teng; Hou, Wen-Hsin |
| 國立成功大學 |
2011-09 |
Predicting Effect of Temperature Field on Sensitization of Alloy 690 Weldments
|
Lee, Hwa Teng; Chen, Chun Te |
| 國立成功大學 |
2011-07 |
Numerical and Experimental Investigation into Effect of Temperature Field on Sensitization of AISI 304 in Butt Welds Fabricated by Gas Tungsten Arc Welding
|
Lee, Hwa Teng; Chen, Chun Te |
| 國立成功大學 |
2011-04-25 |
Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
|
Lee, Hwa-Teng; Chen, Yin-Fa; Schwedt, Alexander; Mayer, Joachim |
| 國立高雄應用科技大學 |
2011 |
Microstructures and magnetostriction of two-phase Fe66-Pd30-Ni4 high-temperature ferromagnetic shape memory alloys
|
Lin, Yin-Chih;Lin, Chien-Feng;Yang, Jin-Bin;Lee, Hwa-Teng |
| 國立成功大學 |
2010-05 |
Intergranular corrosion resistance of nickel-based alloy 690 weldments
|
Lee, Hwa-Teng; Wu, Jia-Lin |
| 國立成功大學 |
2010-01 |
Grain size refinement and magnetostriction of ferromagnetic shape memory Fe-Pd-Rh alloys
|
Lin, Yin-Chih; Lee, Hwa-Teng |
| 國立高雄應用科技大學 |
2010 |
Magnetostriction and magnetic structure in annealed recrystallization of strain-forged ferromagnetic shape memory Fe–Pd–Rh alloys
|
Lin, Yin-Chih;Lee, Hwa-Teng |
| 國立成功大學 |
2009-10 |
Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder
|
Lee, Hwa-Teng; Chen, Yin-Fa |
| 國立成功大學 |
2009-10 |
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
|
Lee, Hwa-Teng; Lee, Choo-Yeow; Lee, Fok-Foo; Chen, Yin-Fa; Lee, Yang-Hsien |
| 國立成功大學 |
2009-08-01 |
Optimizing the EDM hole-drilling strain gage method for the measurement of residual stress
|
Lee, Hwa-Teng; Liu, C. |
| 國立成功大學 |
2009-04 |
Correlation between corrosion resistance properties and thermal cycles experienced by gas tungsten arc welding and laser beam welding Alloy 690 butt weldments
|
Lee, Hwa-Teng; Wu, Jia-Lin |
| 國立成功大學 |
2009-04 |
Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints
|
Lee, Hwa-Teng; Huang, Wen-Yeong |
| 國立成功大學 |
2009-03 |
The effects of peak temperature and cooling rate on the susceptibility to intergranular corrosion of alloy 690 by laser beam and gas tungsten arc welding
|
Lee, Hwa-Teng; Wu, Jia-Lin |
| 國立成功大學 |
2009-02 |
Pop-in Crack Propagation Monitoring for AA2024-T3 Ductile Alloy
|
Lin, H. C.; Ku, T. Y.; Lee, Hwa-Teng |
| 國立成功大學 |
2008-12 |
Calibration of residual stress measurements obtained from EDM hole drilling method using physical material properties
|
Lee, Hwa-Teng; Liu, C. |
| 國立成功大學 |
2008-11 |
Influence of Cu addition on intermetallic compound formation and microstructure of Sn-3Ag-1.5Sb-xCu solder joints
|
Lee, Hwa-Teng; Huang, W. Y.; Chen, Y. F. |
| 國立成功大學 |
2008-08 |
An enhanced calibration scheme for the EDM hole-drilling strain gage method for the measurement of residual stress in ferrous materials
|
Lee, Hwa-Teng; Liu, C.; Hsu, Fu-Chuan; Hsu, J. M. |
| 國立成功大學 |
2008-06 |
Effects of nb on the microstructure and elevated-temperature mechanical properties of alloy 690-SUS 304L dissimilar welds
|
Jeng, Sheng-Long; Lee, Hwa-Teng; Huang, Hunn-Yuan; Kuo, Roang-Ching |
| 國立成功大學 |
2008-06 |
The shear strength and fracture behavior of Sn-Ag-xSb solder joints with Au/Ni-P/Cu UBM
|
Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa |
