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Taiwan Academic Institutional Repository >
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"lee wen hsi"
Showing items 21-30 of 86 (9 Page(s) Totally) << < 1 2 3 4 5 6 7 8 9 > >> View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:37:50Z |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:32:22Z |
An electroplating method for copper plane twin boundary manufacturing
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Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:31:06Z |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
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Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:23:03Z |
Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
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Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:12Z |
Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:45Z |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
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Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
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Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
Showing items 21-30 of 86 (9 Page(s) Totally) << < 1 2 3 4 5 6 7 8 9 > >> View [10|25|50] records per page
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