|
"lee wen hsi"的相關文件
顯示項目 6-30 / 86 (共4頁)
1 2 3 4 > >>
每頁顯示[10|25|50]項目
| 國立交通大學 |
2019-04-02T05:59:51Z |
Pulsed Electrodeposition of CuInSe2 Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:56Z |
Enhancement of the Thermal Stability of TiNx Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
|
Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立成功大學 |
2017-07-19 |
Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy
|
Lee, Wen-Hsi |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2016-12 |
Effect of H-2/He plasma treatment on porous low dielectric constant materials
|
Cheng, Yi-Lung; Haung, Chiao-Wei; Hung, Wei-Jie; Sun, Chung-Ren; Lee, Wen-Hsi |
| 國立成功大學 |
2016-11-25 |
Environmentally-friendly, Pb-free Cu front electrode for Si-based solar cell applications
|
Lee, Wen-Hsi; Lee, Tai-Kuang; Lo, Chiao-Yang |
| 國立成功大學 |
2016-09-19 |
High dopant activation of phosphorus in Ge crystal with high-temperature implantation and two-step microwave annealing
|
Shih, Tzu-Lang;Su, Yin-Hsien;Lee, Wen-Hsi |
| 國立成功大學 |
2016-08-16 |
Effect of annealing temperature on electrical and reliability characteristics of HfO2/porous low-k dielectric stacks
|
Cheng, Yi-Lung; Kao, Kai-Chieh; Chen, Giin-Shan; Fang, Jau-Shiung; Sun, Chung-Ren; Lee, Wen-Hsi |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2016 |
Valence and electronic trap states of manganese in SrTiO3-based colossal permittivity barrier layer capacitors
|
Tsuji, Kosuke; Chen, Wei-Ting; Guo, Hanzheng; Chen, Xiao-Ming; Lee, Tai-Kuang; Lee, Wen-Hsi; Randall, Clive A. |
| 國立交通大學 |
2015-07-21T08:28:43Z |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
|
Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立成功大學 |
2015-03 |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
|
Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立成功大學 |
2015 |
Ultra low-temperature microwave annealing for ultra-shallow junctions and P-MOS devices
|
Tsai, Ming-Han; Wu, Chi-Ting; Hu, Shao-Yu; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:37:57Z |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:37:50Z |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:32:22Z |
An electroplating method for copper plane twin boundary manufacturing
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:31:06Z |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
|
Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:23:03Z |
Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating Process
|
Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
|
Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:12Z |
Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
|
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:45Z |
Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel Silicides
|
Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
顯示項目 6-30 / 86 (共4頁)
1 2 3 4 > >>
每頁顯示[10|25|50]項目
|
