| 國立成功大學 |
2009-03 |
Study on low temperature sintering and microwave dielectric properties of Ba2Ti9O20-based ceramics
|
Lee, Ying-Chieh; Weng, Ko-Wei; Lee, Wen-Hsi; Huang, Yen-Lin |
| 國立成功大學 |
2009-01 |
A Study on Bandwidth Enhancement of 900/1800 Dual Band LTCC Chip Antenna by Using Equivalent Circuit Analysis
|
Lee, Wen-Hsi; Su, Chi-Yi; Chen, Yi-Sen |
| 國立成功大學 |
2009-01 |
High performance OTFTs using surface-modified nanocomposite dielectric gate insulator
|
Wang, Jun Jie; Lee, Wen-Hsi; Ho, Jia Chung; Hu, Tang Shiang |
| 國立成功大學 |
2009 |
Influence of SiO2 Addition on the Dielectric Properties and Microstructure of (Ba0.96Ca0.04)(Ti0.85Zr0.15)O-3 Ceramics
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Lee, Ying-Chieh; Lin, Chia-Wei; Lu, Wei-Hua; Chen, Wen-Jauh; Lee, Wen-Hsi |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
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Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-12 |
Characteristic of Organic Thin Film Transistor with a High-k Insulator of Nano-TiO2 and Polyimide Blend
|
Lee, Wen-Hsi; Wang, Ching-Chieh; Chen, Wei-Ting; Ho, Jia-Chuong |
| 國立成功大學 |
2008-09 |
Performance enhancement of ZnO-based multilayer varistor by constrained sintering
|
Lee, Wen-Hsi; Chen, Wei-Ting; Lee, Ying-Chieh |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Phase development and dielectric properties of BaAl2Si2O8-based low temperature co-fire ceramic material
|
Su, Che-Yi; Huang, Cheng-Liang; Lee, Wen-Hsi |
| 國立成功大學 |
2008-06-30 |
Under-layer behavior study of low resistance Ta/TaNx barrier film
|
Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
The electrical property of plasma-treated Ta/TaNx diffusion barrier
|
Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh |
| 國立成功大學 |
2008-02 |
Measurement techniques of sheet resistance on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chen, Yi-Ren |
| 國立成功大學 |
2008-01 |
Approaches for designing semilump filter utilizing LTCC with hybrid dielectrics
|
Lee, Wen-Hsi; Su, Chi-Yi; Chung, Yu-Chi |
| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
|
Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Investigation of slurry chemical corrosion on TaN barriers with plasma treatment
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2007-04 |
A novel schema to design a compact, low loss, high rejection LTCC bandpass filter
|
Lee, Wen-Hsi; Su, Chi-Yi; Yi, Ching-Chnag |
| 國立成功大學 |
2007-01 |
Optimization and integration of trimethylsilane-based organosilicate glass and organofluorinated silicate glass dielectric thin films for Cu damascene process
|
Cheng, Y. L.; Wang, Y. L.; Hwang, G. J.; Lee, Wen-Hsi; O'Neill, M. L.; Tang, Allen; Wu, C. L. |
| 國立成功大學 |
2007 |
Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Galvanic corrosion between TaNx barriers and copper seed
|
Hung, Chi-Cheng; Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2006-06 |
Relationship between microstructure and electrical properties of ZnO-based multilayer varistor
|
Lee, Wen-Hsi; Chen, Wei-Ting; Lee, Ying-Chieh; Lin, Shih-Pin; Yang, Tony |
| 國立成功大學 |
2004-11 |
Microwave dielectric properties of Zn0.95Mg0.05TiO3+0.25TiO(2) ceramics with 3ZnO-B2O3 addition
|
Lee, Ying-Chieh; Lee, Wen-Hsi; Shiao, Fu-Thang |
