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Showing items 71-86 of 86  (4 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2008-06-30 Under-layer behavior study of low resistance Ta/TaNx barrier film Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2008-02 The electrical property of plasma-treated Ta/TaNx diffusion barrier Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh
國立成功大學 2008-02 Measurement techniques of sheet resistance on copper defects after chemical mechanical polishing Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chen, Yi-Ren
國立成功大學 2008-01 Approaches for designing semilump filter utilizing LTCC with hybrid dielectrics Lee, Wen-Hsi; Su, Chi-Yi; Chung, Yu-Chi
國立成功大學 2008-01 Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2008 Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2008 Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang
國立成功大學 2008 Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh
國立成功大學 2008 Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh
國立成功大學 2008 Investigation of slurry chemical corrosion on TaN barriers with plasma treatment Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang
國立成功大學 2007-04 A novel schema to design a compact, low loss, high rejection LTCC bandpass filter Lee, Wen-Hsi; Su, Chi-Yi; Yi, Ching-Chnag
國立成功大學 2007-01 Optimization and integration of trimethylsilane-based organosilicate glass and organofluorinated silicate glass dielectric thin films for Cu damascene process Cheng, Y. L.; Wang, Y. L.; Hwang, G. J.; Lee, Wen-Hsi; O'Neill, M. L.; Tang, Allen; Wu, C. L.
國立成功大學 2007 Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2007 Galvanic corrosion between TaNx barriers and copper seed Hung, Chi-Cheng; Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang
國立成功大學 2006-06 Relationship between microstructure and electrical properties of ZnO-based multilayer varistor Lee, Wen-Hsi; Chen, Wei-Ting; Lee, Ying-Chieh; Lin, Shih-Pin; Yang, Tony
國立成功大學 2004-11 Microwave dielectric properties of Zn0.95Mg0.05TiO3+0.25TiO(2) ceramics with 3ZnO-B2O3 addition Lee, Ying-Chieh; Lee, Wen-Hsi; Shiao, Fu-Thang

Showing items 71-86 of 86  (4 Page(s) Totally)
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