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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2009-10 Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions Lee, Hwa-Teng; Lee, Choo-Yeow; Lee, Fok-Foo; Chen, Yin-Fa; Lee, Yang-Hsien
國立成功大學 2007-01-25 Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints Lee, Yang-Hsien; Lee, Hwa-Teng
國立成功大學 2006-06-27 Sn-Ag-xNi複合銲料與銅基板間銲點的機械性能及微結構之研究 李洋憲; Lee, Yang-Hsien
國立成功大學 2006-06-27 Sn-Ag-xNi複合銲料與銅基板間銲點的機械性能及微結構之研究 李洋憲; Lee, Yang-Hsien
國立成功大學 2006-03-15 Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints Lee, Hwa-Teng; Lee, Yang-Hsien
南台科技大學 2005-12 Ni粉末添加對Sn-Ag銲料銲點的接合強度之研究 李洋憲 ; Lee, Yang-hsien
國立成功大學 2005-06 Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder Lee, Hwa-Teng; Lee, Yang-Hsien

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