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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立成功大學 |
2009-10 |
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
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Lee, Hwa-Teng; Lee, Choo-Yeow; Lee, Fok-Foo; Chen, Yin-Fa; Lee, Yang-Hsien |
| 國立成功大學 |
2007-01-25 |
Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints
|
Lee, Yang-Hsien; Lee, Hwa-Teng |
| 國立成功大學 |
2006-06-27 |
Sn-Ag-xNi複合銲料與銅基板間銲點的機械性能及微結構之研究
|
李洋憲; Lee, Yang-Hsien |
| 國立成功大學 |
2006-06-27 |
Sn-Ag-xNi複合銲料與銅基板間銲點的機械性能及微結構之研究
|
李洋憲; Lee, Yang-Hsien |
| 國立成功大學 |
2006-03-15 |
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
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Lee, Hwa-Teng; Lee, Yang-Hsien |
| 南台科技大學 |
2005-12 |
Ni粉末添加對Sn-Ag銲料銲點的接合強度之研究
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李洋憲 ; Lee, Yang-hsien |
| 國立成功大學 |
2005-06 |
Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder
|
Lee, Hwa-Teng; Lee, Yang-Hsien |
Showing items 1-7 of 7 (1 Page(s) Totally)
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