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Institution	Date	Title	Author
朝陽科技大學	2017-07	Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate	Chen, Wei-Jhen; Lee, Yue-Lin; Wu, Ti-Yuan; Tzu-Cing, Chen; Hsu, Chih-Hui; Lin, Ming-Tzer

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