|
"leu jihperng"的相关文件
显示项目 66-75 / 76 (共8页)
<< < 1 2 3 4 5 6 7 8 > >>
每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:22:57Z |
Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD
|
Leu, Jihperng; Chang, Chin-Cheng; Chen, Alexander; Lin, Mao-Hsing; Huang, Kun-Feng |
| 國立交通大學 |
2014-12-08T15:22:22Z |
Structural and morphological transformations of TiO2 nanotube arrays induced by excimer laser treatment
|
Hsu, Ming-Yi; Nguyen Van Thang; Wang, Chih; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:21:44Z |
Novel Pore-sealing of Ordered, Porous Silica, SBA-15 for Low-k Underfill Materials
|
Hsu, Kuo-Yuan; Chen, Kuei-Yue; Cheng, Ching-Yuan; Lee, Jhih-Jhao; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:21:37Z |
Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films
|
Che, Mu-Lung; Teng, Jun-Yuan; Lai, Po-Cheng; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:21:32Z |
The Mechanical Property, Microstructure, and Pore Geometry of a Methyltrimethoxysilane Modified Silica Zeolite (MSZ) Film
|
Che, Mu-Lung; Chuang, Shindy; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:21:13Z |
Superior local conductivity in self-organized nanodots on indium-tin-oxide films induced by femtosecond laser pulses
|
Wang, Chih; Wang, Hsuan-I; Tang, Wei-Tsung; Luo, Chih-Wei; Kobayashi, Takayoshi; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:07:49Z |
The impact of microstructure end defects on moisture resistance of novel SiO(x)N(y) passivation layer for OLED applications
|
Chen, Yi-Jen; Hsu, Kuo-Yuan; Chen, Yin-Ying; Su, Cheng-Feng; Tang, Shuenn-Jiun; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:06:48Z |
Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme
|
Che, Mu-Lung; Huang, Cheng-Ying; Choang, Shindy; Chen, Yu-Hen; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:42Z |
Novel Pore-sealing Technology in the Preparation of Low-k Underfill Materials for RF Applications
|
Hsu, Kuo-Yuan; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:04:41Z |
Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties
|
Chen, Hsin-Yuan; Hsu, Kuo-Yuan; Lin, Tsung-Shu; Leu, Jihperng |
显示项目 66-75 / 76 (共8页)
<< < 1 2 3 4 5 6 7 8 > >>
每页显示[10|25|50]项目
|
