| 國立交通大學 |
2017-04-21T06:49:15Z |
A Low-Cost Broadband Bondwire Interconnect for Heterogeneous System Integration
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2017-04-21T06:49:15Z |
A Broadband Interconnect for THz Heterogeneous System Integration
|
Li, Chun-Hsing; Wu, Jan-Jr; Kuo, Chien-Nan; Cheng, Yu-Ting; Kuo, Ming-Ching |
| 國立交通大學 |
2017-04-21T06:49:12Z |
A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration
|
Li, Chun-Hsing; Lai, Chih-Wei; Yan, Tzu-Chao; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:49:05Z |
A 8-mW 77-GHz Band CMOS LNA by Using Reduced Simultaneous Noise and Impedance Matching Technique
|
Ko, Chun-Lin; Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-07-21T11:20:29Z |
A 340 GHz Triple-Push Oscillator With Differential Output in 40 nm CMOS
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-07-21T08:28:58Z |
A 37.5-mW 8-dBm-EIRP 15.5 degrees-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration
|
Li, Chun-Hsing; Chao, Tzu-Yuan; Lai, Chih-Wei; Chen, Wei-Cheng; Ko, Chun-Lin; Kuo, Chien-Nan; Cheng, Yu Ting; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-05-12T02:59:51Z |
INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE
|
Li Chun-Hsing; Kuo Chien-Nan; Ko Chun-Lin |
| 國立交通大學 |
2015-05-12T02:59:46Z |
BROADBAND CONNECTION STRUCTURE AND METHOD
|
Li Chun-Hsing; Kuo Chien-Nan |
| 國立交通大學 |
2014-12-12T02:34:39Z |
共振器耦合網路於射頻前端接收電路及太赫茲連接結構設計之應用
|
李俊興; Li, Chun-Hsing; 郭建男; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:34:49Z |
A 147 GHz Fully Differential D-Band Amplifier Design in 65 nm CMOS
|
Li, Chun-Hsing; Lai, Chih-Wei; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:33:24Z |
A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:32:53Z |
A 0.6-V 0.33-mW 5.5-GHz Receiver Front-End Using Resonator Coupling Technique
|
Li, Chun-Hsing; Liu, Yen-Lin; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:31:25Z |
A 210-GHz Amplifier in 40-nm Digital CMOS Technology
|
Ko, Chun-Lin; Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:30:45Z |
A High Q On-Chip Bondwire Transformer and Its Application to Low Power Receiver Front-End Design
|
Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
| 國立交通大學 |
2014-12-08T15:28:31Z |
A 1.2-V 5.2-mW 20-30-GHz Wideband Receiver Front-End in 0.18-mu m CMOS
|
Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
| 國立交通大學 |
2014-12-08T15:24:34Z |
16.9-mW 33.7-dB Gain mm Wave Receiver Front-End in 65 nm CMOS
|
Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:20:29Z |
Low Power 2.4-GHz Receiver Front-End Using Resoantor Coupling Technique
|
Li, Chun-Hsing; Hsu, Chia-Yu; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:15:31Z |
Broadband flip-chip interconnects for millimeter-wave Si-carrier System-on-Package
|
Li, Chun-Hsing; Fu, Chang Tsung; Chao, Tzu-Yuan; Kuo, Chien-Nan; Cheng, Y. T.; Chang, D. -C. |
| 國立交通大學 |
2014-12-08T15:07:04Z |
An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration
|
Chao, Tzu-Yuan; Li, Chun-Hsing; Chen, Yang Chuan; Chen, Hsin-Yu; Cheng, Yu-Ting; Kuo, Chien-Nan |
| 朝陽科技大學 |
2012-12-31 |
金合歡醇美容水膠貼布配方及品管方法建立
|
李俊興; Li, Chun-Hsing |
| 國立政治大學 |
2009 |
商用不動產市場開發模式之研究-以機場捷運A8車站為例
|
李俊興; Li,chun hsing |
| 國立臺灣大學 |
2004 |
無人飛機平台在無線通訊上的研究
|
李俊興; Li, Chun-Hsing |
