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Showing items 21-32 of 32 (2 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:33:24Z |
A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration
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Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:32:53Z |
A 0.6-V 0.33-mW 5.5-GHz Receiver Front-End Using Resonator Coupling Technique
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Li, Chun-Hsing; Liu, Yen-Lin; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:31:25Z |
A 210-GHz Amplifier in 40-nm Digital CMOS Technology
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Ko, Chun-Lin; Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:30:45Z |
A High Q On-Chip Bondwire Transformer and Its Application to Low Power Receiver Front-End Design
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Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
| 國立交通大學 |
2014-12-08T15:28:31Z |
A 1.2-V 5.2-mW 20-30-GHz Wideband Receiver Front-End in 0.18-mu m CMOS
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Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
| 國立交通大學 |
2014-12-08T15:24:34Z |
16.9-mW 33.7-dB Gain mm Wave Receiver Front-End in 65 nm CMOS
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Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:20:29Z |
Low Power 2.4-GHz Receiver Front-End Using Resoantor Coupling Technique
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Li, Chun-Hsing; Hsu, Chia-Yu; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:15:31Z |
Broadband flip-chip interconnects for millimeter-wave Si-carrier System-on-Package
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Li, Chun-Hsing; Fu, Chang Tsung; Chao, Tzu-Yuan; Kuo, Chien-Nan; Cheng, Y. T.; Chang, D. -C. |
| 國立交通大學 |
2014-12-08T15:07:04Z |
An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration
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Chao, Tzu-Yuan; Li, Chun-Hsing; Chen, Yang Chuan; Chen, Hsin-Yu; Cheng, Yu-Ting; Kuo, Chien-Nan |
| 朝陽科技大學 |
2012-12-31 |
金合歡醇美容水膠貼布配方及品管方法建立
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李俊興; Li, Chun-Hsing |
| 國立政治大學 |
2009 |
商用不動產市場開發模式之研究-以機場捷運A8車站為例
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李俊興; Li,chun hsing |
| 國立臺灣大學 |
2004 |
無人飛機平台在無線通訊上的研究
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李俊興; Li, Chun-Hsing |
Showing items 21-32 of 32 (2 Page(s) Totally)
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