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机构 日期 题名 作者
國立交通大學 2020-07-01T05:21:22Z Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures Li, Yu-Jin; Tu, King-Ning; Chen, Chih
國立交通大學 2020-03-01 Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper Li, Yu-Jin; Chen, Chih; Tu, King-Ning
國立交通大學 2020-02-02T23:55:32Z High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih
國立交通大學 2020-02-02T23:55:32Z Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin
國立交通大學 2020-02-02T23:55:32Z Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng
國立交通大學 2019-12-13T01:12:54Z High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih
國立交通大學 2019-12-13T01:12:53Z Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih
國立交通大學 2019-12-13T01:12:49Z Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.
國立交通大學 2019-04-02T06:04:30Z Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih
國立交通大學 2019-04-02T06:00:50Z Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih

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