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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立成功大學 |
2019-01-14 |
銅/錫/銅接點之室溫電遷移材料反應行為研究
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梁鍵隴; Liang, Chien-Lung |
| 國立成功大學 |
2019-01-14 |
銅/錫/銅接點之室溫電遷移材料反應行為研究
|
梁鍵隴; Liang, Chien-Lung |
| 國立成功大學 |
2016-01 |
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
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Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-03-17 |
Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint During Pre-con and TCT Tests
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
Showing items 1-5 of 5 (1 Page(s) Totally)
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