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| 國立交通大學 |
2018-08-21T05:57:14Z |
The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer
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Liang, Hao-Wen; Chen, Hsiu-Chi; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2018-01-24T07:43:26Z |
三維積體電路之暫時性接合其高分子形貌分析與超薄緩衝層應用於非對稱低溫接合結構
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梁皓雯; 陳冠能; Liang, Hao-Wen; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:37Z |
Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology
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Huang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:06Z |
Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration
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Liang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立臺灣大學 |
2010 |
震動輔助傾斜式進給微放電加工微小孔之探討
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梁豪文; Liang, Hao-Wen |
Showing items 1-5 of 5 (1 Page(s) Totally)
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