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Institution	Date	Title	Author
國立聯合大學	2010	Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads	Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK

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