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Showing items 21-45 of 56  (3 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:43:09Z Generalized interconnect delay time and crosstalk models: I. Applications of interconnect optimization design Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC
國立交通大學 2014-12-08T15:43:09Z Generalized interconnect delay time and crosstalk models: II. Crosstalk-induced delay time deterioration and worst crosstalk models Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC
國立交通大學 2014-12-08T15:42:45Z Implantation induced defects in the retrograde well with a buried layer Hsu, WC; Liang, MS; Chen, MC
國立交通大學 2014-12-08T15:42:27Z Post-implantation thermal annealing effect on the gate oxide of triple-well-structure Hsu, WC; Liang, MS; Lin, CT; Chen, MC
國立交通大學 2014-12-08T15:41:51Z A physical model for the hysteresis phenomenon of the ultrathin ZrO2 film Wang, JC; Chiao, SH; Lee, CL; Lei, TF; Lin, YM; Wang, MF; Chen, SC; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:40:39Z Physical and barrier properties of plasma-enhanced chemical vapor deposited alpha-SiC : H films from trimethylsilane and tetramethylsilane Chiang, CC; Chen, MC; Ko, CC; Wu, ZC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:40:39Z Physical and barrier properties of plasma enhanced chemical vapor deposition alpha-SiC : N : H films Chiang, CC; Wu, ZC; Wu, WH; Chen, MC; Ko, CC; Chen, HP; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:40:31Z Physical and barrier properties of plasma-enhanced chemical vapor deposited alpha-SiCN : H films with different hydrogen contents Chiang, CC; Chen, MC; Ko, CC; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:39:57Z Improvement in leakage current and breakdown field of Cu-comb capacitor using a silicon oxycarbide dielectric barrier Chiang, CC; Ko, IH; Chen, MC; Wu, ZC; Lu, YC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:39:57Z Physical and barrier properties of PECVD amorphous silicon-oxycarbide from trimethylsilane and CO2 Chiang, CC; Ko, IH; Chen, MC; Wu, ZC; Lu, YC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:39:52Z Physical and barrier properties of amorphous silicon-oxycarbide deposited by PECVD from octamethylcyclotetrasiloxane Chiang, CC; Chen, CC; Li, LJ; Wu, ZC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:39:42Z Leakage and breakdown mechanisms of Cu comb capacitors with bilayer-structured alpha-SiCN/alpha-SiC Cu-cap barriers Chiang, CC; Ko, IH; Chen, MC; Wu, ZC; Lu, YC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:39:40Z TDDB reliability improvement of Cu damascene with a bilayer-structured alpha-SiC : H dielectric barrier Chiang, CC; Chen, MC; Wu, ZC; Li, LJ; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:38:46Z Annealing effect on boron high-energy-ion-implantation-induced defects in Hsu, WC; Liang, MS; Chen, SC; Chen, MC
國立交通大學 2014-12-08T15:37:21Z Effects of O-2- and N-2-plasma treatments on copper surface Chiang, CC; Chen, MC; Li, LJ; Wu, ZC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:27:25Z A new bride damage characterization technique for evaluating hot carrier reliability of flash memory cell after P/E cycles Chung, SS; Yih, CM; Cheng, SM; Liang, MS
國立交通大學 2014-12-08T15:27:02Z Plasma process induced damage in sputtered TiN metal gate capacitors with ultra-thin nitrided oxide Chen, CC; Lin, HC; Chang, CY; Chao, TS; Huang, SC; Wu, WF; Huang, TY; Liang, MS
國立交通大學 2014-12-08T15:27:02Z Improved plasma charging immunity in ultra-thin gate oxide with fluorine and nitrogen implantation Chen, CC; Lin, HC; Chang, CY; Huang, CC; Chien, CH; Huang, TY; Liang, MS
國立交通大學 2014-12-08T15:27:01Z Electrical reliability issues of integrating low-K dielectrics with Cu metallization Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:26:57Z Edge hole direct tunneling in off-state ultrathin gate oxide p-channel MOSFETs Yang, KN; Huang, HT; Chen, MJ; Lin, YM; Yu, MC; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:26:55Z N-channel versus P-channel flash EEPROM - Which one has better reliabilities Chung, SS; Liaw, ST; Yih, CM; Ho, ZH; Lin, CJ; Kuo, DS; Liang, MS
國立交通大學 2014-12-08T15:26:48Z Comparative study of physical and electrical characteristics of F- and C-doped low-K CVD oxides Wu, ZC; Shiung, ZW; Chiang, CC; Wu, WH; Chen, MC; Jeng, SM; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:26:48Z Barrier characteristics of PECVD alpha-SiC : H dielectrics Chiang, CC; Wu, ZC; Wu, WH; Chen, MC; Ko, CC; Chen, HP; Jeng, SM; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:26:29Z TDDB reliability improvement in Cu damascene by using a bilayer-structured PECVD SiC dielectric barrier Chiang, CC; Chen, MC; Wu, ZC; Li, LJ; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:26:17Z Impacts of HF etching on ultra-thin core gate oxide integrity in dual gate oxide CMOS technology Lee, DY; Lin, HC; Chen, CL; Huang, TY; Wang, TH; Lee, TL; Chen, SC; Liang, MS

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