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机构 日期 题名 作者
國立交通大學 2014-12-08T15:43:09Z Generalized interconnect delay time and crosstalk models: I. Applications of interconnect optimization design Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC
國立交通大學 2014-12-08T15:43:09Z Generalized interconnect delay time and crosstalk models: II. Crosstalk-induced delay time deterioration and worst crosstalk models Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC
國立交通大學 2014-12-08T15:42:45Z Implantation induced defects in the retrograde well with a buried layer Hsu, WC; Liang, MS; Chen, MC
國立交通大學 2014-12-08T15:42:27Z Post-implantation thermal annealing effect on the gate oxide of triple-well-structure Hsu, WC; Liang, MS; Lin, CT; Chen, MC
國立交通大學 2014-12-08T15:41:51Z A physical model for the hysteresis phenomenon of the ultrathin ZrO2 film Wang, JC; Chiao, SH; Lee, CL; Lei, TF; Lin, YM; Wang, MF; Chen, SC; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:40:39Z Physical and barrier properties of plasma-enhanced chemical vapor deposited alpha-SiC : H films from trimethylsilane and tetramethylsilane Chiang, CC; Chen, MC; Ko, CC; Wu, ZC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:40:39Z Physical and barrier properties of plasma enhanced chemical vapor deposition alpha-SiC : N : H films Chiang, CC; Wu, ZC; Wu, WH; Chen, MC; Ko, CC; Chen, HP; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:40:31Z Physical and barrier properties of plasma-enhanced chemical vapor deposited alpha-SiCN : H films with different hydrogen contents Chiang, CC; Chen, MC; Ko, CC; Jang, SM; Yu, CH; Liang, MS
國立交通大學 2014-12-08T15:39:57Z Improvement in leakage current and breakdown field of Cu-comb capacitor using a silicon oxycarbide dielectric barrier Chiang, CC; Ko, IH; Chen, MC; Wu, ZC; Lu, YC; Jang, SM; Liang, MS
國立交通大學 2014-12-08T15:39:57Z Physical and barrier properties of PECVD amorphous silicon-oxycarbide from trimethylsilane and CO2 Chiang, CC; Ko, IH; Chen, MC; Wu, ZC; Lu, YC; Jang, SM; Liang, MS

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