|
English
|
正體中文
|
简体中文
|
Total items :0
|
|
Visitors :
51741294
Online Users :
1025
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"liang s w"
Showing items 6-15 of 30 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:24:57Z |
Joule heating effect under accelerated electromigration in flip-chip solder joints
|
Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
|
Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:23:02Z |
Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints
|
Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:19:48Z |
Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints
|
Chen, Tzu Yu; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
|
Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:16:11Z |
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
|
Chang, Y. W.; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:08Z |
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results
|
Liang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:14:47Z |
Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
Showing items 6-15 of 30 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page
|
