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"liang s w"的相关文件
显示项目 11-20 / 30 (共3页)
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| 國立交通大學 |
2014-12-08T15:16:11Z |
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
|
Chang, Y. W.; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:08Z |
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results
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Liang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:14:47Z |
Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
| 國立交通大學 |
2014-12-08T15:13:17Z |
Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:14Z |
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
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Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:08Z |
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
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Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng |
| 國立交通大學 |
2014-12-08T15:09:31Z |
Effect of bump size on current density and temperature distributions in flip-chip solder joints
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Kuan, Wei-Chih; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
显示项目 11-20 / 30 (共3页)
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