|
"liang s w"的相關文件
顯示項目 16-30 / 30 (共2頁)
1 2 > >>
每頁顯示[10|25|50]項目
| 國立交通大學 |
2014-12-08T15:13:17Z |
Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:14Z |
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
|
Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:08Z |
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
|
Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng |
| 國立交通大學 |
2014-12-08T15:09:31Z |
Effect of bump size on current density and temperature distributions in flip-chip solder joints
|
Kuan, Wei-Chih; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
|
Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
|
Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:06:49Z |
Effects of current crowding and Joule heating on reliability of solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立臺灣科技大學 |
2014 |
Global development of parliamentary websites and key factors of influence
|
Lu, H.-P.;Liang, S.-W. |
| 國立臺灣科技大學 |
2014 |
A study on using the kano two-dimensional quality model to evaluate the service quality of government websites
|
Liang, S.-W.;Lu, H.-P.;Kuo, T.-K. |
| 國立臺灣科技大學 |
2013 |
Adoption of e-government services: An empirical study of the online tax filing system in Taiwan
|
Liang, S.-W.;Lu, H.-P. |
| 國立臺灣科技大學 |
2011 |
Optimization Parameters of Femtosecond Laser Isolation Processing for a Microcrystalline Silicon Thin Film Solar Cell
|
Kuo, C.F.J.;Liang, S.W.;Tu, H.M. |
| 國立臺灣科技大學 |
2010 |
Optimization of microcrystalline silicon thin film solar cell isolation processing parameters using ultraviolet laser
|
Kuo C.-F.J.;Tu H.-M.;Liang S.-W.;Tsai W.-L. |
| 國立臺灣大學 |
2006 |
Trace metal (Cd, Cu, Ni and Pb) partitioning, affinities and removal in the Danshuei River estuary, a macro-tidal, temporally anoxic estuary in Taiwan
|
Kuo, T.J.; Liang, S.W.; Peter H. Santschi |
| 國立臺灣大學 |
1991 |
Toughening in Composites of Alumina Reinforced with Nickel. Part 2, Microstructural Investigation
|
Chang, L.; Chen, S. C.; 段維新; Chu, T. Y.; Liang, S. W; Chang, L.; Chen, S. C.; Tuan, Wei-Hsing; Chu, T. Y.; Liang, S. W |
| 臺大學術典藏 |
1991 |
Toughening in Composites of Alumina Reinforced with Nickel. Part 2, Microstructural Investigation
|
Liang, S. W; Chang, L.; Chen, S. C.; Chu, T. Y.; Liang, S. W; Tuan, Wei-Hsing; Chang, L.; Chen, S. C.; 段維新; Chu, T. Y.; Liang, S. W; Chang, L.; Tuan, Wei-Hsing |
顯示項目 16-30 / 30 (共2頁)
1 2 > >>
每頁顯示[10|25|50]項目
|
