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| 臺大學術典藏 |
2021-05-31T07:54:15Z |
Ser1333 phosphorylation indicates ROCKI activation
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Chuang H.-H.; Liang S.-W.; ZEE-FEN CHANG; Lee H.-H. |
| 國立交通大學 |
2019-04-02T06:00:15Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
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Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立臺灣科技大學 |
2016 |
The knowledge discovery of the nuclear power issue using the artificial intelligence model: An example of the CART and the SVM
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Chung, Y.-S;Ho, M.H.-C;Huang, S.-J;Liang, S.-W. |
| 國立臺灣科技大學 |
2015 |
A study on using the kano two-dimensional quality model to evaluate the service quality of government websites
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Liang, S.-W.;Lu, H.-P.;Kuo, T.-K. |
| 國立交通大學 |
2014-12-08T15:48:13Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
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Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:24:57Z |
Joule heating effect under accelerated electromigration in flip-chip solder joints
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Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
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Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:23:02Z |
Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints
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Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:19:48Z |
Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints
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Chen, Tzu Yu; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
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Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
Showing items 1-10 of 30 (3 Page(s) Totally)
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