| 臺大學術典藏 |
2021-05-31T07:54:15Z |
Ser1333 phosphorylation indicates ROCKI activation
|
Chuang H.-H.; Liang S.-W.; ZEE-FEN CHANG; Lee H.-H. |
| 國立交通大學 |
2019-04-02T06:00:15Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立臺灣科技大學 |
2016 |
The knowledge discovery of the nuclear power issue using the artificial intelligence model: An example of the CART and the SVM
|
Chung, Y.-S;Ho, M.H.-C;Huang, S.-J;Liang, S.-W. |
| 國立臺灣科技大學 |
2015 |
A study on using the kano two-dimensional quality model to evaluate the service quality of government websites
|
Liang, S.-W.;Lu, H.-P.;Kuo, T.-K. |
| 國立交通大學 |
2014-12-08T15:48:13Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:24:57Z |
Joule heating effect under accelerated electromigration in flip-chip solder joints
|
Chiu, S. H.; Liang, S. W.; Chen, Chili; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
|
Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:23:02Z |
Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints
|
Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:19:48Z |
Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints
|
Chen, Tzu Yu; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
|
Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:16:11Z |
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
|
Chang, Y. W.; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:08Z |
Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results
|
Liang, S. W.; Chang, Y. W.; Chen, Chih; Liu, Y. C.; Chen, K. H.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:14:47Z |
Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Electromigration issues in lead-free solder joints
|
Chen, Chih; Liang, S. W. |
| 國立交通大學 |
2014-12-08T15:13:17Z |
Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns
|
Liang, S. W.; Chang, Y. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:14Z |
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
|
Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:08Z |
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
|
Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng |
| 國立交通大學 |
2014-12-08T15:09:31Z |
Effect of bump size on current density and temperature distributions in flip-chip solder joints
|
Kuan, Wei-Chih; Liang, S. W.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
|
Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
|
Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:06:49Z |
Effects of current crowding and Joule heating on reliability of solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立臺灣科技大學 |
2014 |
Global development of parliamentary websites and key factors of influence
|
Lu, H.-P.;Liang, S.-W. |
| 國立臺灣科技大學 |
2014 |
A study on using the kano two-dimensional quality model to evaluate the service quality of government websites
|
Liang, S.-W.;Lu, H.-P.;Kuo, T.-K. |
| 國立臺灣科技大學 |
2013 |
Adoption of e-government services: An empirical study of the online tax filing system in Taiwan
|
Liang, S.-W.;Lu, H.-P. |
| 國立臺灣科技大學 |
2011 |
Optimization Parameters of Femtosecond Laser Isolation Processing for a Microcrystalline Silicon Thin Film Solar Cell
|
Kuo, C.F.J.;Liang, S.W.;Tu, H.M. |
| 國立臺灣科技大學 |
2010 |
Optimization of microcrystalline silicon thin film solar cell isolation processing parameters using ultraviolet laser
|
Kuo C.-F.J.;Tu H.-M.;Liang S.-W.;Tsai W.-L. |
| 國立臺灣大學 |
2006 |
Trace metal (Cd, Cu, Ni and Pb) partitioning, affinities and removal in the Danshuei River estuary, a macro-tidal, temporally anoxic estuary in Taiwan
|
Kuo, T.J.; Liang, S.W.; Peter H. Santschi |
| 國立臺灣大學 |
1991 |
Toughening in Composites of Alumina Reinforced with Nickel. Part 2, Microstructural Investigation
|
Chang, L.; Chen, S. C.; 段維新; Chu, T. Y.; Liang, S. W; Chang, L.; Chen, S. C.; Tuan, Wei-Hsing; Chu, T. Y.; Liang, S. W |
| 臺大學術典藏 |
1991 |
Toughening in Composites of Alumina Reinforced with Nickel. Part 2, Microstructural Investigation
|
Liang, S. W; Chang, L.; Chen, S. C.; Chu, T. Y.; Liang, S. W; Tuan, Wei-Hsing; Chang, L.; Chen, S. C.; 段維新; Chu, T. Y.; Liang, S. W; Chang, L.; Tuan, Wei-Hsing |
