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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:25:40Z |
3-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressing
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Liang, SW; Shao, TL; Chen, C |
| 國立交通大學 |
2014-12-08T15:25:35Z |
Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
|
Chiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH |
| 國立交通大學 |
2014-12-08T15:17:41Z |
Relieving the current crowding effect in flip-chip solder joints during current stressing
|
Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN |
| 國立交通大學 |
2014-12-08T15:17:09Z |
Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes
|
Chou, CK; Chen, CA; Liang, SW; Chen, C |
| 國立交通大學 |
2014-12-08T15:16:48Z |
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
|
Liang, SW; Chang, YW; Chen, C |
| 國立交通大學 |
2014-12-08T15:16:40Z |
Temperature and current-density distributions in flip-chip solder joints with Cu traces
|
Hsu, CY; Yao, DJ; Liang, SW; Chen, C; Yeh, ECC |
Showing items 1-6 of 6 (1 Page(s) Totally)
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