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"liang y c"的相關文件
顯示項目 171-180 / 257 (共26頁) << < 13 14 15 16 17 18 19 20 21 22 > >> 每頁顯示[10|25|50]項目
| 元智大學 |
2015-05-07 |
Developing a Practical Execution Time-frame for the MRCPSP/max
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Angela Hsiang-Ling Chen; Liang Y.-C.; Jose David Padilla |
| 國立臺灣科技大學 |
2015 |
Surface-enhanced Raman scattering on a silver film-modified Au nanoparticle-decorated SiO2 mask array
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Chang, C.-C.;Chen, L.-Y.;Yang, K.-H.;Chen, Q.-Y.;Liang, Y.-C.;Lin, S.-Y.;Liu, Y.-C. |
| 國立交通大學 |
2014-12-08T15:48:05Z |
Pressure-dependent electronic structures in multiferroic DyMnO(3): A combined lifetime-broadening-suppressed x-ray absorption spectroscopy and ab initio electronic structure study
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Chen, J. M.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Huang, S. W.; Jeng, H. T.; Lu, K. T.; Chen, T. H.; Liang, Y. C.; Chen, S. W.; Chuang, W. T.; Sheu, H-S.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Lin, C. M.; Yang, T. J. |
| 國立交通大學 |
2014-12-08T15:32:24Z |
Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
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Lin, C. K.; Tsao, Wei An; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:30:34Z |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
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Liang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S. |
| 國立交通大學 |
2014-12-08T15:30:31Z |
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
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Liang, Y. C.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:27:04Z |
Pressure dependence of the electronic structure and spin state in Fe(1.01)Se superconductors probed by x-ray absorption and x-ray emission spectroscopy
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Chen, J. M.; Haw, S. C.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Lu, K. T.; Liang, Y. C.; Lee, Y. C.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Yang, T. J. |
| 國立交通大學 |
2014-12-08T15:22:00Z |
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
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Liang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao |
| 元智大學 |
2014-12-06 |
系統模擬於LED封裝廠可靠度實驗排程之應用
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陳香伶; 楊宜琴; Liang Y.-C. |
| 元智大學 |
2014-11-28 |
A two-phase algorithm for the sequential vehicle routing problem with cross-docking
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Liang Y.-C.; María José Saavedra Madriz; Chi-Yi Chen; Hsiang-Ling Angela Chen |
顯示項目 171-180 / 257 (共26頁) << < 13 14 15 16 17 18 19 20 21 22 > >> 每頁顯示[10|25|50]項目
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