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| 國立交通大學 |
2018-08-21T05:53:32Z |
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
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Chang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye |
| 朝陽科技大學 |
2017-08-31 |
中學女性教師親職角色衝突與調適之研究－以五位育有學前子女者為例
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梁瑀宭; LIANG, YU-CHUN |
| 國立交通大學 |
2017-04-21T06:50:04Z |
Generic Rules to Achieve Bump Electromigration Immortality for 3D IC Integration
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Chen, Hsiao-Yun; Shih, Da-Yuan; Wei, Cheng-Chang; Tung, Chih-Hang; Hsiao, Yi-Li; Yu, Douglas Cheng-Hua; Liang, Yu-Chun; Chen, Chih |
| 國立暨南國際大學 |
2014 |
高學歷已婚婦女的婆媳關係調適之研究
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梁瑜君; Liang, Yu-Chun |
Showing items 1-4 of 4 (1 Page(s) Totally)
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