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Institution Date Title Author
國立中山大學 2002-09 A Novel Through-Wafer Electrical Interconnection Fabrrication Technique for MEMS Wafer Level Chip Scale Package Chung-Yu Chiang;I-Yu Huang;Lieh-Hsi Lo;Henry J.H. Chen;Star R.S. Huang
國立中山大學 2002-05 A New Structured ISFET with Integrated Ti/Pd/Ag/AgCl Electrode and Micromachined Back-side P+ Contacts I-Yu Huang; Ruey-Shing Huang; Lieh-Hsi Lo

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