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Institution	Date	Title	Author
國立交通大學	2014-12-16T06:14:01Z	Wafer level packaging method and a packaging structure using thereof	Chen Tsung-Lin; Lien Jui-Chien
國立交通大學	2014-12-12T01:48:08Z	研發微電阻銲接與矽晶圓穿孔製程?應用於微系統封裝技術	練瑞虔; Lien, Jui-Chien; 陳宗麟; Chen, Tsung-Lin

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