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"lim wee chin"的相关文件
显示项目 1-9 / 9 (共1页)
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| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-12T01:39:54Z |
砷化銦鎵元件覆晶封裝於低成本有機基板(RO 3210)之W-band應用
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林瑞琴; Lim, Wee-Chin; 張翼; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:22Z |
Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation
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Hsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:38:24Z |
Improvement in RF performance of 40-nm InAs-channel based HEMTs using Pt gate sinking with two-step recess processes technology
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Kuo, Chien-I; Hsu, Heng-Tung; Wu, Chien-Ying; Chang, Edward Y.; Chen, Yu-Lin; Lim, Wee-Chin |
| 國立交通大學 |
2014-12-08T15:37:07Z |
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
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Wang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:33:24Z |
Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology
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Wang, Chin-Te; Hsu, Heng-Tung; Chiang, Che-Yang; Chang, Edward Yi; Lim, Wee-Chin |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
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Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
显示项目 1-9 / 9 (共1页)
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