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"lin ah der"
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| 中國文化大學 |
2022-11 |
Derivation and Verification of Laminated Composite T-Beam Theory
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Lyu, Yu-Ting; Hung, Tsung-Pin; Ay, Herchang; Tsai, Hsiu-An; Chiang, Yih-Cherng; Lin, Ah-Der |
| 正修科技大學 |
2018-06 |
Stainless Steel Surface Coating with Nanocrystalline Ag Film by Plasma Electrolysis Technology
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Lin, Ah-Der; Kung, Chi-Liang; Cao, You-Qing; Hsu, Chao-Ming; Chen, Cheng-Yi |
| 正修科技大學 |
2018 |
Study on Cleaning the Surface of Stainless Steel 316 Using Plasma Electrolysis Technology
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Lin, Ah-Der; Kung, Chi-Liang; Hsieh, Wei-Chen; Hsu, Chao-Ming; Chen, Cheng-Yi |
| 國立高雄應用科技大學 |
2013 |
Shear Toughness Evaluation of Solder Joints for the Reliability Tests
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Hsu, Chao-Ming; Lin, Ah-Der; Hung, Tsung-Pin; Chiu, Wen-Chun |
| 國立高雄應用科技大學 |
2013 |
The Creep Parameters of SAC305 Unleaded Solders
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Hsu, Chao-Ming; Lin, Ah-Der; Kuang, Jao-Hwa |
| 國立高雄應用科技大學 |
2013 |
The Effect of Plaque and Artery Parameters on Stent Expansion during the Implantation Process
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Hsu, Chao-Ming; Lin, Ah-Der; Chien, Hui-Lung; Chen, Yung-Yu; Kuang, Jao-Hwa |
| 正修科技大學 |
2012-02-27 |
An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints
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Hung, Tsung-Pin; Hsu, Chao-Ming; Lin, Ah-Der; Kuang, Jao-Hwa |
| 正修科技大學 |
2012-02-27 |
The Surface Absorption Coefficient of S304L Stainless Steel by Nd:YAG Micro-Pulse Laser
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Hung, Tsung-Pin; Kuang, Jao-Hwa; Lai, Kuen; Hsu, Chao-Ming; Lin, Ah-Der |
| 國立高雄應用科技大學 |
2012-02 |
An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints
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Hsu, Chao-Ming; Hung, Tsung-Pin; Lin, Ah-Der; Kuang, Jao-Hwa |
| 國立高雄應用科技大學 |
2012 |
Stainless Steel Surface Etching Morphologies Using Electro Plasma Technology
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Lin, Ah-Der; Hsu, Chao-Ming; Chen, Chich-Kuan; Huang, Da-Yun; Hung, Tsung-Pin; Kuang, Jao-Hwa |
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