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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2020-07-01T05:21:48Z |
An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
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Lin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng |
| 國立交通大學 |
2020-07-01T05:21:48Z |
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
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Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng |
| 國立交通大學 |
2020-02-02T23:55:32Z |
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
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Lin, Yu-Min; Wu, Sheng-Tsai; Wang, Chun-Min; Lee, Chia-Hsin; Huang, Shin-Yi; Lin, Ang-Ying; Chang, Tao-Chih; Lin, Puru Bruce; Ko, Cheng-Ta; Chen, Yu-Hua; Su, Jay; Liu, Xiao; Prenger, Luke; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP
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Shen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng |
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