|
English
|
正體中文
|
简体中文
|
Total items :2815474
|
|
Visitors :
27467159
Online Users :
367
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"lin benson"
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2020-02-02T23:55:32Z |
High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines
|
Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:54Z |
High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging
|
Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging
|
Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
