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"lin c k"的相關文件
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| 國立交通大學 |
2014-12-08T15:36:03Z |
Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing
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Lin, C. K.; Liu, Chien-Ming; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:35:56Z |
Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints
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Lin, C. K.; Chang, Yuan Wei; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:35:14Z |
Theory and Applications of Sum-Frequency Generations
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Lin, C. K.; Yang, L.; Hayashi, M.; Zhu, C. Y.; Fujimura, Y.; Shen, Y. R.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:32:24Z |
Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
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Lin, C. K.; Tsao, Wei An; Liang, Y. C.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
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Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:19:49Z |
Electrical characterization of fine-pitch compliant bumps
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Lin, C. K.; Chen, Chih; Chang, Shyh-Ming; An, Chao-Chyun; Lee, Hsiao Ting; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu |
| 國立交通大學 |
2014-12-08T15:03:37Z |
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
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Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L. |
| 國立交通大學 |
2014-12-08T15:01:52Z |
Electrical characterization of fine-pitch compliant bumps
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Lin, C. K.; Chen, Chih; Chang, Shyh-Ming; An, Chao-Chyun; Lee, Hsiao Ting; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu |
| 國立臺灣科技大學 |
2014 |
One-step synthesis and characterization of nanosized bioactive glass
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Shih, S.-J.;Chou, Y.-J.;Chen, C.-Y.;Lin, C.-K. |
| 國立臺灣科技大學 |
2014 |
Model-free predictive current control for interior permanent-magnet synchronous motor drives based on current difference detection technique
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Lin, C.-K.;Liu, T.-H.;Yu, J.-T.;Fu, L.-C.;Hsiao, C.-F. |
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