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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立臺灣科技大學 2015 Electrochemical detection of uric acid using ruthenium-dioxide-coated carbon nanotube directly grown onto Si wafer Shih, Y.-T.;Lee, K.-Y.;Lin, C.-K.
臺大學術典藏 2015 Factors associated with subsequent nontuberculous mycobacterial lung disease in patients with a single sputum isolate on initial examination LI-NA LEE; Wang J.-Y.; Ko J.-C.; Lee M.-R.; Yang C.-Y.; Shu C.-C.; Lin C.-K.; Wen Y.-F.; Lee S.-W.; Yu C.-J.
臺大學術典藏 2015 Plasma biomarkers can predict treatment response in tuberculosis patients: A prospective observational study Yu C.-J.; LI-NA LEE; Shu C.-C.; Wang J.-Y.; Lin C.-K.; Chang L.-Y.; Yang C.-M.; Chuang T.-Y.; Wang W.-J.; Lee M.-R.; Tsai C.-J.
臺大學術典藏 2015 Factors associated with subsequent nontuberculous mycobacterial lung disease in patients with a single sputum isolate on initial examination Lee M.-R.; Yang C.-Y.; Shu C.-C.; Lin C.-K.; Wen Y.-F.; Lee S.-W.; Ko J.-C.; JANN-YUAN WANG; Lee L.-N.; Yu C.-J.
臺大學術典藏 2015 Clinical characteristics of bacteraemia caused by Lactobacillus spp. and antimicrobial susceptibilities of the isolates at a medical centre in Taiwan, 2000-2014 Lee M.-R.; Tsai C.-J.; Liang S.-K.; Lin C.-K.; Huang Y.-T.; PO-REN HSUEH
國立交通大學 2014-12-08T15:36:03Z Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing Lin, C. K.; Liu, Chien-Ming; Chen, Chih
國立交通大學 2014-12-08T15:35:56Z Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints Lin, C. K.; Chang, Yuan Wei; Chen, Chih
國立交通大學 2014-12-08T15:35:14Z Theory and Applications of Sum-Frequency Generations Lin, C. K.; Yang, L.; Hayashi, M.; Zhu, C. Y.; Fujimura, Y.; Shen, Y. R.; Lin, S. H.
國立交通大學 2014-12-08T15:32:24Z Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis Lin, C. K.; Tsao, Wei An; Liang, Y. C.; Chen, Chih
國立交通大學 2014-12-08T15:24:15Z Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N.

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