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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:56:58Z |
The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCD
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Chang, Shyh-Ming; Kao, Kuo-Shu; An, Chao-Chyun; Chen, Ming-Yao; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Wen-Chih |
| 國立交通大學 |
2017-04-21T06:49:47Z |
Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters
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Hsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:42Z |
Fine pitch "NCF-type Compliant-bumped COG"
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An, Chao-Chyun; Chang, Shyh-Ming; Chen, Ming-Yao; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Ren-Haw; Chen, Wen-Chih |
| 國立交通大學 |
2017-04-21T06:49:41Z |
Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"
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Chen, Ming-Yao; An, Chao-Chyun; Chang, Shyh-Ming; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang |
| 國立交通大學 |
2014-12-12T02:42:10Z |
覆晶銲錫之電遷移研究: 溫度對破壞機制的影響與電阻曲線之分析
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林宗寬; Lin, Chung-Kuang; 陳 智; Chen, Chih |
| 東海大學 |
1998 |
布拉姆斯「四首嚴肅歌」之研究
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林中光; Lin, Chung-Kuang |
Showing items 1-7 of 7 (1 Page(s) Totally)
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