| 臺大學術典藏 |
2020-08-05T00:38:53Z |
Association of circulating matrix metalloproteinase-1, but not adiponectin, with advanced coronary artery disease
|
Hwang J.-J.; Yang W.-S.; Chiang F.-T.; Chen M.-F.; Lin H.-J.; Huang P.-J.; SANDY HUEY-JEN HSU; Lai S.-K.; Wu Y.-W. |
| 臺大學術典藏 |
2020-07-29T08:08:39Z |
Evaluation of a health-promoting school program to enhance correct medication use in Taiwan
|
Lin H.-J.; Huang L.-J.; JUNG-CHEN CHANG; Yeh M.-K.; Kang J.-J.; Chang F.-C.; Chi H.-Y.; Chi H.-Y.;Chang F.-C.;Lin H.-J.;Huang L.-J.;Jung-Chen Chang;Yeh M.-K.;Kang J.-J. |
| 臺大學術典藏 |
2020-06-29T05:41:24Z |
Inter-machine consistency of the sensory organization test with human subjects and standardized weights
|
Ming-Hsia Hu;Lin H.-J.;Ou Y.-J.;Deng G.-J.;Lin P.-C.; MING-HSIA HU; Lin H.-J.; Ou Y.-J.; Deng G.-J.; Lin P.-C. |
| 臺大學術典藏 |
2020-06-01T09:06:45Z |
Clinical outcomes of basal insulin and oral antidiabetic agents as an add-on to dual therapy in patients with type 2 diabetes mellitus
|
Cheng C.-N.;Chih-Yuan Wang;Lin H.-W.;Chang T.-Y.;Lin H.-J.;Chou C.;Lin F.-J.; Cheng C.-N.; CHIH-YUAN WANG; Lin H.-W.; Chang T.-Y.; Lin H.-J.; Chou C.; Lin F.-J. |
| 臺大學術典藏 |
2020-05-20T05:11:43Z |
Effects of 12 weeks of atorvastatin therapy on myocardial fibrosis and circulating fibrosis biomarkers in statin-na?ve patients with hypertension with atherosclerosis
|
Lin Y.-H.;Lin H.-J.;Hung C.-S.;Kao H.-L.;YEN-TING LIN;Lin Y.-M.;Lee J.-K.;Wu Y.-W.;Chang Y.-Y.; Chang Y.-Y.; Wu Y.-W.; Lee J.-K.; Lin Y.-M.; YEN-TING LIN; Kao H.-L.; Hung C.-S.; Lin H.-J.; Lin Y.-H. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads
|
TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy
|
Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers
|
TUNG-HAN CHUANG; Chuang, T.H.; Lin, H.J. |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn
|
Chuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
|
Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing
|
Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
High performance Ag-Pd alloy wires for high frequency IC packages
|
Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content
|
Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
|
Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 淡江大學 |
2020-05 |
Utilizing ion leaching effects for achieving record-high oxygen-evolving performances on hybrid nanocomposite with self-optmized behaviors
|
Guan, D.;Ryu, G.;Hu, Z.;Zhou, J.;Dong, C. L.;Huang, Y. C.;Zhang, K.;Zhong, Y.;Komarek, A. C.;Zhu, M.;Wu, X.;Pao, C. W.;Chang, C. K.;Lin, H. J.;Chen, C. T.;Zhou, W.;Shao, Z. |
| 臺大學術典藏 |
2020-04-24T08:53:22Z |
Van der Waal Epitaxy of Flexible and Transparent VO2 Film on Muscovite
|
Li, C.-I.; Lin, J.-C.; Liu, H.-J.; Chu, M.-W.; Chen, H.-W.; Ma, C.-H.; Tsai, C.-Y.; Huang, H.-W.; Lin, H.-J.; Liu, H.-L.; Chiu, P.-W.; Chu, Y.-H. |
| 臺大學術典藏 |
2020-04-24T08:53:20Z |
Atomic-scale observation of a graded polar discontinuity and a localized two-dimensional electron density at an insulating oxide interface
|
Chu, M.-W.; Cheng, S.-L.; Pong, W.F.; Shao, Y.C.; Chin, Y.Y.; Lin, H.-J.; Chen, C.W.; Yang, J.-R.; Chen, C.H.; Jeng, H.T.; Lin, J.G.; Chang, C.-P. |
| 臺大學術典藏 |
2020-04-24T01:34:14Z |
Consumption of betel quid contributes to sensorineural hearing impairment through arecoline-induced oxidative stress
|
Hsu C.-J.; Chen-Chi Wu; Chan Y.-H.; Liu T.-C.; Liao C.-K.; Cheng Y.-F.; Tsai C.-H.; Lu Y.-C.; Hu C.-J.; Lin H.-J.; Lee Y.L. |
| 淡江大學 |
2020-04-24 |
Voltage-and time-dependent valence state transition in cobalt oxide catalysts observed by in-operando soft-x ray spectroscopy during oxygen evolution reaction
|
Zhou, J.;Zhang, L.;Huang, Y. C.;Dong, C. L.;Lin, H. J.;Chen, C. T.;Tjeng, L. H.;Hu, Z. |
| 臺大學術典藏 |
2020-04-21T03:52:34Z |
Orbital symmetry and electron correlation in Nax CoO2
|
Chen, C. T.; Chou, F. C.; Lin, H. J.; Huang, D. J.; Okamoto, J.; Wu, W. B. |
