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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2007-08 Evaluations of the BGA solder ball shape by using energy method Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng
國立成功大學 2007-06-08 以二階子模型結合實驗設計法進行多晶片模組可靠度之最佳化分析 林恒正; Lin, Heng-Cheng
國立成功大學 2006-04 An optimization analysis of UBM thicknesses and solder geometry on a wafer level chip scale package using robust methods Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng; Liang, Gin-Tiao
國立成功大學 2000-05 Optimal dimension of PQFP by using Taguchi method Chen, Rong-Sheng; Lin, Heng-cheng; Kung, Chieh

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