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Taiwan Academic Institutional Repository >
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"lin heng cheng"
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| 國立成功大學 |
2007-08 |
Evaluations of the BGA solder ball shape by using energy method
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Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng |
| 國立成功大學 |
2007-06-08 |
以二階子模型結合實驗設計法進行多晶片模組可靠度之最佳化分析
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林恒正; Lin, Heng-Cheng |
| 國立成功大學 |
2006-04 |
An optimization analysis of UBM thicknesses and solder geometry on a wafer level chip scale package using robust methods
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Lin, Heng-Cheng; Kung, Chieh; Chen, Rong-Sheng; Liang, Gin-Tiao |
| 國立成功大學 |
2000-05 |
Optimal dimension of PQFP by using Taguchi method
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Chen, Rong-Sheng; Lin, Heng-cheng; Kung, Chieh |
Showing items 1-4 of 4 (1 Page(s) Totally)
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