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"lin hong ching"
Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:15:51Z |
Effects of metallo-organic decomposition agents on thermal decomposition and electrical conductivity of low-temperature-curing silver paste
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Lu, Chun-An; Lin, Pang; Lin, Hong-Ching; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:15:00Z |
Characterization of the low-curing-temperature silver paste with silver 2-ethylhexanoate addition
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Lu, Chun-An; Lin, Pang; Lin, Hong-Ching; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:13:42Z |
Effects of silver oxide addition on the electrical resistivity and microstructure of low-temperature-curing metallo-organic decomposition silver pastes
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Lu, Chun-An; Lin, Pan; Lin, Hong-Ching; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:11:00Z |
High-frequency electrical properties of silver thick films measured by dielectric resonator method
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Lin, Hong-Ching; Lin, Pang; Lu, Chun-An; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:10:37Z |
A COMPACT CASCADE QUADRUPLET BANDPASS FILTER WITH LOW TEMPERATURE COFIRED CERAMIC TECHNOLOGY
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Lin, Hong-Ching; Lin, Pang; Tang, Ching-Wen; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:10:13Z |
Microstructure and Electrical Resistivity of Low-Temperature-Cured Silver Films Prepared Using Silver Oxide and Silver Stearate Pastes
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Lin, Hong-Ching; Lin, Pang; Lu, Chun-An; Wang, Sea-Fue |
| 國立交通大學 |
2014-12-08T15:08:25Z |
Effects of silver oxalate additions on the physical characteristics of low-temperature-curing MOD silver paste for thick-film applications
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Lin, Hong-Ching; Lin, Pang; Lu, Chun-An; Wang, Sea-Fue |
Showing items 1-7 of 7 (1 Page(s) Totally)
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